Product category:
Electronics Manufacturing, Production and Packaging
News Release from: Elmos Semiconductor
Edited by the Electronicstalk Editorial
Team on 29 March 2007
Semiconductor packages for high
temperatures
At a workshop, new packaging and manufacturing techniques for the use of semiconductors at high temperatures was demonstrated.
Elmos Semiconductor has presented at a seminar new packaging and manufacturing techniques for the use of semiconductors at high temperatures The main focus was on standard packaging technologies, that sustain temperatures up to 200C
This article was originally published on Electronicstalk on 22 Jul 2005 at 8.00am (UK)
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The whole production process from chip manufacturing to packaging, qualification and high temperature testing was thereby observed.
The results presented were developed within the scope of the research project "Hotpants" funded by the federal ministry for education and research.
The funded project started in 2003.
The competence consortium consisted of well-known semiconductor manufacturers Atmel, Bosch and Elmos, the test equipment producer Multitest, the package specialist MPD und the Fraunhofer Institute for Reliability in micro integration (IZM).
"We achieved the goal of developing high-temperature capable standard packages and the necessary bond and material systems for cost-effective solutions", says Dr Frank Rottmann, member of the board for development and sales at Elmos Semiconductor.
Up to now, assembly and packaging technologies suitable for the serial production of elements exceeding 150C were non-existant.
For use beyond this temperature the structure and metal material for the bond pads on a chip had to be modified.
In combination with decent mould mass, so called green compounds, aging effects and stress by temperature can be drastically reduced, making an application over 200C possible.
"The results of the funding project will be of great use to all project partners and permits the exertion of semi conductors at hot spots in the automobile".
"Such application can be found in the vicinity of the motor, the gears, the brakes and also, for example, at the alternator", explains Rottmann.
In various presentations, the workshop, with over 50 participants from the automotive industry and the semi conductor branch, discussed the method to obtain the temperature sustainable package.
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