Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Ellsworth Adhesives
Edited by the Electronicstalk Editorial
Team on 13 March 2007
Adhesive films and preforms set for
Nepcon launch
Ellsworth Adhesives has confirmed plans to launch its new Techfilm product range at Nepcon 2007, where it will also showcase a range of established technologies.
Ellsworth Adhesives has confirmed plans to launch its new Techfilm product range at Nepcon 2007, where it will also showcase a range of established technologies Techfilm specialises in developing B-staged adhesive films and preforms that replace liquids in highly intricate bonding applications
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The product range includes both thermally and electrically conductive materials that are used by leading aerospace, automotive, computer and telecommunications manufacturers.
Using integrated CAD, Techfilm can custom design films and preforms providing consistent and accurate production processing, thus eliminating waste and migration issues but providing improved aesthetics and superior bondline integrity.
Ellsworth will also be presenting a number of established technologies from their product portfolio along with a selection of packaging from its Kitpackers operation.
Through its Kitpackers operation, Ellsworth is able to support most specialised custom packaging needs, allowing their customers to deliver reduced costs through the improvement of product application.
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