Thermal profiling to illustrate lead-free concepts

SolderStar is to sponsor the "thermal profiling" elements of the extremely popular Lead Free Experience seminars organised by the Smart Group at Nepcon UK in Brighton.

SolderStar is to sponsor the "thermal profiling" elements of the extremely popular Lead Free Experience seminars organised by the Smart Group at Nepcon UK in Brighton.

Delegates will be able to see and use profiling equipment, using lead-free alternative alloys on assemblies featuring ball grid array, surface mount, 0201 chip components and through-hole terminations.

They will also be able to witness and discuss many of the issues raised by one of the most significant industry changes in many years.

Delegates can also bring board designs and process issues and have all their questions answered by leading subcontract partners, Solectron, Celestica and lead-free research group National Physical laboratory (NPL).

SolderStar profiling systems will be available at the seminars for "hand-on" use on BGA rework stations, convection reflow ovens and the wave soldering process.

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