Product category:
IC and Hybrid Processing Equipment
News Release from: Engis (UK) | Subject: SM lapping machines
Edited by the Electronicstalk Editorial
Team on 23 November 2004
More control for wafer polishing
Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users.
Responding to customer demand for full CMP kinematics in an affordable wafer polishing/planarising machine, Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users Available in 14 and 20in plate size models, the machines are built to SEMI S2 standards and provide independent variability for speed, direction, time, oscillation rate and oscillation speed
This article was originally published on Electronicstalk on 5 Apr 2005 at 8.00am (UK)
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Machine features include a pressure range of 44.5 to 445N and speeds of 5-65rev/min, with platen drive speeds of 5-100rev/min.
The data acquisition system (DAS) can reside within the machine processor and be linked via Ethernet, which also provides the possibility of remote computer control.
Computer controlled programmability includes independent programming of plate and workstation parameters, both program motor and workstation motor offer slow-start (ramping) time, maximum speed, delay and direction, in addition workstation pressure ramping, delay and maximum value are enabled.
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