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Product category: IC and Hybrid Processing Equipment
News Release from: Engis (UK) | Subject: EHG 150AV
Edited by the Electronicstalk Editorial Team on 21 September 2005

Small-footprint grinder gets wafers into
shape

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Engis (UK) has released the new, small-footprint EHG 150AV horizontal grinder with a full suite of accessories.

Engis (UK) has released the new, small-footprint EHG 150AV horizontal grinder with a full suite of accessories The machine is particularly applicable to wafer grinding and offers thickness control presets, +/-1um size/parallel accuracy using independent wafer and wheel spindles

Building on its extensive experience of the manufacture of horizontal spindle grinders Engis has developed this new, competitively priced and easy to operate horizontal grinder for individual and small quantity wafer loads.

The grinder offers automatic sizing and three-way motion to provide reduced surface and subsurface damage and edge-chipping - providing an increased yield in operation.

Ergonomically designed, the machine offers good access to the loading/unloading area, and offers a choice of either a vacuum or magnetic chuck, with quick release feature, as well as offering a lighted work area with see-through splash cover.

The operator panel is intuitive and easy to use, with full control over the grinding wheel, work and oscillation functions.

Separate chuck feeding and spark-out time displays have been integrated into the design as well as a thickness start/stop sizing/removal preset and readout which have also been accommodated.

The EHG-150AV horizontal spindle grinder is provided as standard with a 50 litre capacity coolant pump with a 25W motor, high output capability, with noncorrosive construction in a compact footprint.

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