Product category:
IC and Hybrid Processing Equipment
News Release from: Engis (UK)
Edited by the Electronicstalk Editorial
Team on 19 June 2006
Polished performance on show in
Frankfurt
Engis UK is exhibiting at the Optatec in Frankfurt for the first time this year, offering visitors information and assistance on optics material polishing with superabrasives.
Engis UK is exhibiting at the Optatec in Frankfurt for the first time this year, offering visitors information and assistance on optics material polishing with superabrasives, together with the opportunity to discuss their specific processing challenges Engis' extensive R and D activity into the polishing of ultrahard materials including silicon carbide and sapphire, which has led to considerable reductions in sapphire processing times using composite plate technology and the unique CMP-D process
As part of the world-wide Engis Corporation, Engis UK is able to provide customers with complete, integrated superabrasives solutions, including both consumables and equipment from the same manufacturer.
Complete lapping and polishing consumable packages, including diamond, aluminium oxide, cerium oxide, polyurethane pads and pitch, are available for use on a wide range of materials.
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