Product category:
IC and Hybrid Processing Equipment
News Release from: Engis (UK) | Subject: EHG 170AV
Edited by the Electronicstalk Editorial
Team on 10 October 2006
Enhanced wafer grinder comes to the UK
Engis' enhanced wafer grinding machine, the EHG 170AV, is now available to UK customers.
Engis' enhanced wafer grinding machine, the EHG 170AV, is now available to UK customers This small footprint, horizontal grinder is particularly suitable for surface grinding advanced materials including, wafers and windows to the highest level of flatness
This article was originally published on Electronicstalk on 23 Nov 2004 at 8.00am (UK)
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The launch of the EHG 170AV demonstrates Engis' commitment to develop technology specifically for customers in the advanced materials processing market, to which it brings its unrivalled expertise in superabrasive and lapping technologies.
Developed from the very successful, earlier EHG-150AV, the newly designed and technically enhanced machine remains a competitively priced and easy to operate horizontal grinder for individual and small quantity wafer loads, but offers improved functionality including centre-wheel coolant delivery to ensure optimal coolant dispersal, an updated operating system and an enlarged capacity cooling system.
Specification options include a coolant cooling unit, a cartridge filter and flow sensor and a magnetic or vacuum chuck.
The grinder offers automatic sizing and three-way motion to provide reduced surface and subsurface damage and edge-chipping - providing an increased yield in operation.
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