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Endicott Interconnect Technologies

Address:
1093 Clark Street
Endicott
NY 13760
USA

http://www.eitny.com

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Listing of all 4 news releases from Endicott Interconnect Technologies:

Production deal secures organic substrate supplies

Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.

News from Endicott Interconnect Technologies ( 7 April 2008)

Complex controller board stretches expertise

 User application article   Board is a core component in the Osmosis research project on next-generation optical switch technology in high-performance computing systems.

News from Endicott Interconnect Technologies (22 January 2008)

Chinese plant gears up for high volumes

Endicott Interconnect Technologies now offers high-volume low-cost fully assembled PC boards via its new 3700m2 facility in China.

News from Endicott Interconnect Technologies ( 1 October 2007)

PC boards suit mainframe use

EI can provide high-density, double-sided, hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of over 1500

News from Endicott Interconnect Technologies ( 7 September 2007)

 

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