http://www.electronicstalk.com/news/enz/enz000.html Endicott Interconnect Technologies news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Sat, 22 Nov 2008 08:00:00 UT Sat, 22 Nov 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set. Mon, 07 Apr 2008 08:00:00 UT Endicott Interconnect Technologies http://www.electronicstalk.com/news/enz/enz104.html Board is a core component in the Osmosis research project on next-generation optical switch technology in high-performance computing systems. Tue, 22 Jan 2008 08:00:00 UT Endicott Interconnect Technologies http://www.electronicstalk.com/news/enz/enz103.html Endicott Interconnect Technologies now offers high-volume low-cost fully assembled PC boards via its new 3700m2 facility in China. Mon, 01 Oct 2007 08:00:00 UT Endicott Interconnect Technologies http://www.electronicstalk.com/news/enz/enz102.html EI can provide high-density, double-sided, hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of over 1500 Fri, 07 Sep 2007 08:00:00 UT Endicott Interconnect Technologies http://www.electronicstalk.com/news/enz/enz101.html