PC boards suit mainframe use

EI can provide high-density, double-sided, hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of over 1500

Large, high-complexity PC boards for use in compute-intensive applications such as servers and mainframes for defence, aerospace, and commercial applications are available from Endicott Interconnect (EI) Technologies.

EI can provide high-density, double-sided, hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of over 1500, including high-I/O area array modules (CGA, LGA, PBGA) and dense, high-I/O connectors.

"These are very large, complex boards with high I/O count BGAs, a lot of SMT and press fit connectors, and on-board through-hole soldered power supplies", said Stephen Howland, Product Manager of EI Complex Assembly Operations.

"They are for customers who require a lot of processing power and a lot of memory".

Endicott Interconnect provides the capability of going from bare board to a complex PC board assembly that is finished, populated and fully tested.

Howland said "A 610 x 914 board might have as many as 100 BGA attached devices on one side".

EI's full hybrid assembly capabilities can provide a wide range of PC board assemblies from high-end, complex, mission critical to lower complexity, depending on customer requirements.

"We manufacture the raw board and then assemble it to customer specifications", said Vic Barba, Director of Engineering for Complex Assembly Operations.

"A typical build cycle from fab to finished board is approximately two weeks".

EI has spent US $7 million in capital equipment, including six new assembly lines in the past 12 months, to meet the increased demand for its large, complex, PC board assemblies.

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