Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Endicott Interconnect Technologies | Subject: CoreEZ organic substrates
Edited by the Electronicstalk Editorial
Team on 07 April 2008
Production deal secures organic
substrate supplies
Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.
Endicott Interconnect Technologies has signed a sales and manufacturing agreement whereby Unimicron Technology Corp of Taiwan will produce CoreEZ organic substrates at one of its facilities As the original design manufacturer, Endicott will maintain control of the design and technical support worldwide for the CoreEZ product line
This article was originally published on Electronicstalk on 7 Sep 2007 at 8.00am (UK)
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Unimicron will be the high-volume manufacturer of CoreEZ products to Endicott's specifications and requirements.
Sales of CoreEZ product will be jointly handled by the two companies.
CoreEZ organic substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.
It is ideally suited to high speed graphics and microprocessor applications.
"We are very excited about this opportunity to partner with Unimicron".
"We believe their sales and marketing infrastructure, skilled workforce and world-class facilities will provide an efficient manufacturing process to our customers worldwide", says Michael J Hills, Senior VP Sales, Marketing and Business Development at Endicott Interconnect Technologies.
"Working with Unimicron enables us to offer high volume production and manufacturing in a low cost region".
"We anticipate an increase in design wins and the associated new product introduction activity, which positively affects the proliferation of CoreEZ into the marketplace", he adds.
"We look forward to our participation in this innovative manufacturing initiative with EI to build up sales of this exceptional substrate technology and enhance our capability to offer the most advanced processes and products", says David Cheng, Executive President of Unimicron IC Carrier Group.
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