Board assemblies stretch PCB performance

Complex PC board assemblies from Endicott Interconnect Technologies (EI) are providing solutions for customers who face challenges as they stretch the boundaries of PCB performance.

EI is developing new materials, processes and interconnect strategies that help to advance technologies and provide solutions for customer requirements in defence, aerospace, medical, computing/IT infrastructure and advanced test equipment applications.

'When you look at a complex PC board assembly, you see the end result,' said Rex Green, product manager of EI's complex assembly operations.

'What you don't see are the many steps leading up to it, such as design, engineering, materials development, and substrate and board fabrication.

'EI performs all of those and then adds system integration and testing to the mix,' he added.

EI provides a wide range of assembly capabilities, including high-density, double-sided, hybrid PC board assemblies (SMT/PTH/press fit) with high component counts, high-I/O area array modules (CGA, LGA, PBGA), and dense, high-I/O connectors for complex, compute-intensive applications.

Once the assembly is complete, EI designs and executes strategies for a wide range of analogue, digital, power supply and Jtag testing.

EI can handle virtually any form factor, from <1in2 to 6ft2, and nearly any component placement solution - all in a high-mix production environment with line-to-line repeatability, quick change feeder systems and solder volume, X-ray and AOI process controls.

EI can tailor its capabilities to best suit individual application requirements.

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