Papers delve into critical design challenges

The Technical Programme Committee of Euro DesignCon 2004 has accepted 40 papers from more than 120 submissions by practicing engineers in semiconductor and electronic design.

The Technical Programme Committee of Euro DesignCon 2004 has accepted 40 papers from more than 120 submissions by practicing engineers in semiconductor and electronic design.

Each paper will offer in-depth perspectives presented during a 45-minute session devoted to the following technical tracks: design verification, silicon system design, chip-level physical design, test and debug, high-speed interconnect systems, automotive system design and wireless communication system design.

"A hallmark of DesignCon events is that we delve deeply into the most critical challenges facing semiconductor and electronic design engineers and develop a very in-depth learning forum that will yield solutions that can be implemented immediately in their designs", explained John Janowiak, Senior Director of the IEC.

Janowiak cited the event's technical forums as another example of the highly focused learning environment where an array of subjects will be examined including "Advances in platform ASICs", "M-LVDS in practice: new life for multipoint buses", "Applying physics-based analysis to the design and verification" and "Signal integrity analysis for clock and datacom applications".

Based on IEC's highly successful DesignCon programme in the USA, Euro DesignCon presentations will address current issues that are most significant to the European semiconductor and electronic design community.

In addition to the technical paper presentations and technical forums, the event will offer a comprehensive educational program of keynote addresses, plenary and technical panels, and a hands-on technology exhibition featuring more than 30 industry-leading companies.

Euro DesignCon 2004 will take place from 11th to 14th October 2004 at the ArabellaSheraton Grand Hotel in Munich, Germany.

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