Graphite interface shifts heat more efficiently

New eGraf Hitherm thermal interface products provide phase-change-like performance without the reflow or rework issue of phase-change interface materials.

New eGraf Hitherm thermal interface products provide phase-change-like performance without the reflow or rework issue of phase-change interface materials.

This is essential in the battle to reduce interface resistance between hot components and heatsinks.

All of Graftech's interface materials have a thermal conductivity of about 200W/mK in plane but different thermal conductivity through the thickness.

The new Hitherm material has been developed for low thermal contact resistance at low pressure and provides an improvement from the 7W/mK of the 700 series and 12 W/mK from the 1200 series through the thickness to the Hitherm's 20 W/mK.

With good thermal conductivity in plane there is heatspreading at the interface material level.

Standard rolls and cut sheets are available in thicknesses of 3, 5 and 10mil, with products available up to 60mil thickness.

Various options for finish including bare, single, double, electrical insulation, and edge seal pressure sensitive adhesive.

Edge seal ensures low contact resistance by not introducing an adhesive layer at the interface joint.

Graftech products are available in the UK and Ireland from European Thermodynamics.

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