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Product category: Capacitors
News Release from: Epcos | Subject: MAT chip capacitors
Edited by the Electronicstalk Editorial Team on 14 February 2002

Low ESR for multi-element tantalum chips

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Multiple-anode tantalum (MAT) chip capacitor technology is by far the most effective solution for applications demanding ultra low ESR.

Today, multiple-anode tantalum (MAT) chip capacitor technology is by far the most effective solution for applications demanding ultra low ESR Until now designers looking to use this technology have been limited to a single supplier

But not any more, as the introduction of a new range of MAT chip capacitors from Epcos opens up a second source for the technology, providing designers with a choice.

The new surface-mount tantalum devices incorporate multiple capacitor elements, in parallel, inside a single small package.

This design allows Epcos to achieve an extremely low ESR value down to either 30 or 35mohm maximum at 100kHz - much lower than is possible in a traditional single element package.

Other benefits include superior capacitance retention at high frequencies, with reduced ESL.

A very high ripple current capability, of up to 3A at 100kHz, make these capacitors the ideal choice for switch mode power supply filtering applications.

They are also an effective solution for the power decoupling of leading-edge microprocessors, by substantially reducing the part count necessary to achieve the total capacitance required and the ultra low ESR figure.

For EDP systems employing the very latest microprocessors, running at very high clock speeds, these new MAT chip capacitors offer the only effective solution.

The new capacitors are available in ratings of 330uF/10V DC, 470uF/6.3V DC and 680uF/4V DC.

With a footprint of only 7.3 x 4.3mm, and a height of 4.1mm they are an ideal choice when space is limited.

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