SAWs shrink to new standard sizes

Edited by the Electronicstalk editorial team May 31, 2004

The introduction of surface acoustic wave filters in CSSP3 (third-generation chip-size SAW package) technology is claimed as a new milestone in miniaturisation for applications such as mobile phones.

The introduction of surface acoustic wave filters in CSSP3 (third-generation chip-size SAW package) technology is claimed as a new milestone in miniaturisation for applications such as mobile phones.

CSSP3, which is the result of consistent development of the CSSP technology patented by Epcos, permits miniaturisation of SAW filters by a further 40%, so that mobile phone manufacturers can integrate more and more functions into handsets without increasing weight or size.

Epcos is creating two new product families in CSSP3 technology.

Product family 1411 with a footprint of 1.4 x 1.1mm and insertion height of 0.4mm supersedes current standard 2014.

The second, product family 1513 with a footprint of 1.5 x 1.3mm and insertion height of less than 0.6mm, supersedes current standard 2016.

Epcos, one of the largest suppliers of passive products worldwide, currently has a world market share of over 40% in SAW filters for mobile phones.