Study to address switch to lead-free solder

The Reliability and Failure Analysis Group of ERA Technology is to carry out a survey to determine the state of readiness of UK industry for the transition to lead-free soldering.

The Reliability and Failure Analysis Group of ERA Technology has received support from the ERA Foundation to carry out a survey to determine the state of readiness of UK industry for the transition from traditional tin/lead to alternative lead-free solders.

The EU is banning the sale of products containing lead-based solders from 1st July 2006.

This may seem a long way off, but there are no existing satisfactory lead-free solders that could be used as a straight replacement.

That means manufacturing techniques will have to be adapted, and in some cases, different components used.

A preliminary survey has already been undertaken by ERA to estimate the depth of the problem.

This seems to indicate that although most companies contacted had at least started thinking about the subject, most companies in one sector have not started any work at all.

This sector comprises smaller PCB manufacturers, which are typically used by other smaller companies.

A widespread reaction so far amongst those companies contacted has been that they will only start thinking about the issue when their customers ask for lead-free products.

One lesson, which is already emerging, must be that the onus is on companies to talk to their subcontractors.

The results of the project will be used to promulgate best practice, highlight future problems, identify training needs and help individual companies to meet the EU deadline.

ERA will disseminate results of the programme through seminars, conferences and the ERA website.

(This was Electronicstalk's Top Story on 16 January 2003).

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