Product category:
Design and Development Software
News Release from: EDA Solutions
Edited by the Electronicstalk Editorial
Team on 03 June 2005
Alliance speeds mixed-signal design
X-Fab Semiconductor Foundries has signed a collaborative agreement with Tanner EDA, the worldwide leader in tools for analogue/mixed-signal IC and MEMS design on the Windows platform.
X-Fab Semiconductor Foundries has signed a collaborative agreement with Tanner EDA, the worldwide leader in tools for analogue/mixed-signal IC and MEMS design on the Windows platform X-Fab works closely with Tanner EDA to build and deliver comprehensive design kits for analogue/mixed-signal ICs targeting mainstream process technologies
This article was originally published on Electronicstalk on 2 May 2008 at 8.00am (UK)
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The collaboration ensures that design teams are able to accelerate product development and achieve high levels of design quality while keeping EDA costs tightly under control.
"We see the proliferation of products requiring RF/wireless technology, cutting edge graphics and imaging technology, and extreme power management environments driving the challenges of analogue and mixed-signal design further and faster than any other trends in the IC industry", said Dr John Tanner, President and CEO of Tanner Research.
"When combined with increasing market demand for features, competitive time to market pressures, rising costs of development and shrinking revenues, IC designers in this area face challenges that form the critical path in typical new product development".
Further reading
Analogue simulator adds Verilog-A module
Circuit blocks such as oscillators can be simulated at high level, enabling incompatibilities with other parts of the system to be identified early in the design process.
Low-volume custom designs add CMOS image sensors
CMOS image sensors are available as part of multiproject wafers.
"It is crucial that not only do they choose suppliers that deliver the highest performance/cost ratios, but that suppliers partner to integrate their solutions".
"The combination of jointly developed design kits for X-Fab technologies and proven Tanner EDA tools for analogue/mixed-signal design enables faster development and high quality while keeping costs in line".
"The alliance between X-Fab and Tanner provides for a large category of mixed-signal designers access to the design kits they need to meet the challenges of this growing segment", said Dr Jens Kosch, CTO of X-Fab group.
"The match was a natural one, as both companies are dedicated to providing the highest levels of performance, world class customer service and a value proposition that is within reach of an industry becoming increasingly cost conscious".
"With our processes and design kits, and Tanner EDA's HiPer Silicon platform, designers have a smooth and efficient path from design capture through to physical implementation".
"Our customers will benefit from faster time to market, lower costs, lower risks and shorter cycle times".
In addition to the existing Tanner PDKs (process development kits) at the process nodes 1.0, 0.8, 0.6 and 0.35um, X-Fab released its latest Tanner PDK for the 0.35um 3.3V BiCMOS process at the end of April 2005.
The 0.35um BiCMOS technology offers three- or four-layer metallisation with the option for an alternative thick fourth layer metallisation, double poly and MiM capacitor as well high resistive poly.
This technology is especially suitable for RF circuits and high precision analogue applications.
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