Product category:
Electronics Manufacturing Services
News Release from: EDA Solutions | Subject: 90nm MPW service
Edited by the Electronicstalk Editorial
Team on 11 May 2006
Shared wafers extend to IBM 90nm process
Multiproject wafer (MPW) services company Mosis has teamed up with IBM's silicon foundry to offer 90nm chip process technology on a shared-wafer basis.
Multiproject wafer (MPW) services company Mosis has teamed up with IBM's silicon foundry to offer 90nm chip process technology on a shared-wafer basis The MPW service will give many companies that have previously found submicron silicon fabrication costs prohibitive access to these technologies for as little as 10% of the price of a dedicated wafer run
This article was originally published on Electronicstalk on 7 Oct 2003 at 8.00am (UK)
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It will enable these companies to produce from 40 to several hundred chips while only paying for the proportion of the mask set and wafers that their devices use.
The 90nm MPW service is supported with easy access to proven design kits and comprehensive documentation.
There are regular wafer runs to minimise time to market and devices can be supplied as wafers, die or assembled parts in plastic or ceramic packages.
Furthermore, partly processed wafers can be held in stock to enable rapid production of additional chip samples or fast turn-around of fixes to the metal layers if a respin is needed.
Mixed signal designs where power consumption is critical, or where there is a high degree of complexity and functional integration, can benefit from moving to smaller-geometry process technologies.
Wireless, consumer video and audio, and high-speed communications are typical applications.
In addition to the IMB 90nm process, Mosis now also offers MPW services based on TSMC's 130nm process technology.
In Europe, the Mosis service is exclusively available from EDA Solutions, based in Southampton, UK.
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