Product category:
Electronics Manufacturing Services
News Release from: EDA Solutions | Subject: Mosis MPW service
Edited by the Electronicstalk Editorial
Team on 14 September 2006
Short run ASICs add plastic package
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Mosis has signed a strategic agreement with Sempac that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits.
Mosis has signed a strategic agreement with Sempac that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits The deal will give customers who use the Mosis multiproject wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from Sempac's Open-Pak product line
This article was originally published on Electronicstalk on 8 Mar 2007 at 8.00am (UK)
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These premoulded air-cavity packages meet the latest JEDEC outline and footprint standards.
This means that devices can be designed for high volume production with streamlined testing to further reduce costs.
Open-Pak packages are made from semiconductor-grade plastics.
They have copper lead frames that are gold plated to military standards.
As a result, the packages are mechanically stable with similar electrical characteristics to fully encapsulated, moulded types.
The Mosis MPW service allows multiple products to be fabricated on each mask set and silicon wafer; cost sharing is based on the physical area used by each design.
Both integrated device manufacturers (IDMs) and fabless semiconductor companies use MPW services to dramatically reduce chip development costs when they need a few tens of samples for evaluation.
However, the service is equally cost-effective for low volume production, typically up to 1000 pieces of each device.
When device evaluation is complete, migration to a dedicated wafer run for high volume production is easily realised.
Commenting on the Sempac deal, Mosis Deputy Director, Wes Hansford, said: "Our service is about enabling innovation amongst semiconductor businesses, particularly in an environment where shrinking chip geometries mean that dedicated mask sets and wafers are not affordable for some designs".
"Reducing the cost of packaging without compromising performance or reliability through this agreement is one more way in which we can help our customers attain their new product development goals quickly and economically".
Sempac packaging is available through Mosis now, and the Mosis service is exclusively available in Europe through EDA Solutions.
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