Product category:
PCB Assembly Equipment and Tools
News Release from: Essemtec | Subject: FLX1020 and FLX1030
Edited by the Electronicstalk Editorial
Team on 15 March 2004
Flexibility is key to pick-and-place
productivity
The FLX1020 and FLX1030 are multiple-head pick-and-place machines with speeds up to 15,000 components per hour.
The FLX1020 and FLX1030 are multiple-head pick-and-place machines with speeds up to 15,000 components per hour Up to 300 different components can be loaded simultaneously
This article was originally published on Electronicstalk on 9 Jan 2008 at 8.00am (UK)
Related stories
Pick and place system boosts capacity
Essemtec's new SMD pick and place machine allows faster loading/unloading of PCBs compared to systems without a conveyor.
Foils developed for large frameless stencils
DEK has extended its VectorGuard to 29" by 29" - a convenient new frameless foil system that is said to be set to revolutionize large format applications.
Large formats get frameless foil system
DEK has added large foils to its range of VectorGuard stencils, allowing customers to reduce changeover time and ease stencil handling and storage challenges in large image area applications.
Changeover between products is possible without downtime and the system even allows the parallel assembly of two different PCBs.
Thanks to this extraordinary flexibility, the machines guarantee maximum productivity even when the changeover frequency is high.
A complete software package for production planning, feeder setup optimisation, setup control with barcode and component stock management is included in the package.
During production all placement and component data are stored and are available for later tracing or analysis.
The universal conversion software is very flexible and accepts all CAD formats.
If these data are not available, a PCB can easily be programmed with the virtual teach-in function.
Dispensing systems for glue or solder paste can be integrated, the dispensing programs are automatically produced from the pick and place data.
The large variety of feeders and the precision of the machine allows manufacturers to place components ranging from 0201 up to 50 x 50mm, fine-pitch components down to 12mil, BGA and microBGA and even flip chip devices.
Feeders for high or odd-shaped components are also available, making the FLX1020/1030 the most versatile placement system for highly flexible production runs.
• Essemtec: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
