Product category:
Standard Logic Devices
News Release from: Fairchild Semiconductor | Subject: MicroPak packaging for TinyLogic
Edited by the Electronicstalk Editorial
Team on 24 April 2001
Flat-bottomed packages shrink logic
devices
Fairchild Semiconductor has added an option of MicroPak packaging to its TinyLogic portfolio, claiming the most significant space savings available in the logic market.
Fairchild Semiconductor has added an option of MicroPak packaging to its TinyLogic portfolio, claiming the most significant space savings available in the logic market Designed with a footprint of only 1.45 by 1.00mm and a height of only 0.55mm, MicroPak is 65% smaller than the SC70 package
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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MicroPak draws its space savings from flat-bottomed packages and environmentally friendly lead-free lands, rather than leads for the 2nd-level interconnect to the users' circuit board.
In addition to space savings, the lack of leads eliminates potential loss of coplanarity during the production process and allows the MicroPak products to be soldered to the board more efficiently.
Using a common land pattern for 5- and 6-terminal products, devices in this family facilitate board revisions with minimal layout changes.
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And with a pad pitch of 0.5mm, and overall outline dimensions similar to passive chip components, high volume pick and place equipment is compatible with MicroPak.
This allows easy qualification for board redesigns.
The first products to be released in this packaging will be the NC7SZ125L three-state buffer, NC7SZ04L and NC7S04L inverters.
These products are all manufactured using advanced CMOS processes.
This assures ultrahigh speed and low power circuit operation over a broad VCC range, with the most effective overvoltage protection in the industry.
Fairchild plans to introduce the MicroPak option for its entire single and dual TinyLogic portfolio of logic functions, which includes both the HS and UHS TinyLogic series.
These devices are primarily intended to bring additional functionality and increased performance to space constrained products such as cellular telephones, PDAs, watches, cameras, PCMCIA cards, portable computers and docking stations.
Wireless and handheld design trends are moving towards integrating DSP logic into ASICs.
This creates more opportunities for 1-2 gates or buffers and the need for smaller, higher quality, lower power and cost-effective logic solutions.
Fairchild has been at the forefront of this revolution since 1995 when it introduced single gate logic in the SOT23 packaging.
Single gate logic allows designers to condition system control signals more precisely.
The results are quick product feature re-spins and the elimination of the need for quad gate and octal buffers/inverters, for power and space saving purposes.
Fairchild's SOT23 package evolved with the development of the 5- and later the 6-lead SC-70 package, followed by the US8, 8-lead package and most recently the MicroPak package.
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