Product category:
Standard Logic Devices
News Release from: Fairchild Semiconductor | Subject: NC7NZ14 and NC7NZ04
Edited by the Electronicstalk Editorial
Team on 30 May 2001
Smallest leaded package for triple
buffer/inverter
The latest additions to Fairchild's TinyLogic family of US8-packaged devices are the NC7NZ14 triple inverter with Schmitt trigger inputs and the NC7NZ04 triple inverter.
The latest additions to Fairchild's TinyLogic family of US8-packaged devices are the NC7NZ14 triple inverter with Schmitt trigger inputs and the NC7NZ04 triple inverter These ultra-high-speed devices are fabricated with advanced CMOS technology to achieve superior performance with high-output drive while maintaining low static power dissipation over a broad VCC operating range of 1.65 to 5.5V
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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Fairchild Semiconductor has made a number of additions to its LCX family, the logic industry standard for 3.3V applications.
Inputs and outputs are high impedance when VCC is zero volts.
The inputs tolerate voltages up to 7V, independent of VCC operating voltage.
Additionally these devices have the advanced characteristics of the TinyLogic UHS family, with TPD speed of 3ns at 3.3V, making them ideal for use in high-speed computing devices.
These new buffers in the US8 package are particularly valuable in portable devices such as, notebook PCs, PDAs and digital cameras, as well as desktop and server computers.
Designers will benefit by the availability of multiple buffers and inverters in a single package.
For example, buffers with Schmitt trigger inputs, such as the NC7NZ14, can be used to restore distorted logic levels at the inputs to an ASIC.
Similarly, an NC7NZ04 triple inverter, will invert inputs to the required polarity.
With the introduction of these new dual functions, Fairchild is now the only viable alternative source for 2-3bit logic gates in the industry's smallest 8-lead package.
The US8 can be fit into a board-mounting space of just 2 x 3.1mm, and within a height of less than 1mm.
This reduces the area compared with older 8-lead packages by greater than a 50%.
Compared with 14-lead TSSOP packaged devices, these dual buffers in US8 packages provide an 80% reduction in required board area.
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