Product category:
Standard Logic Devices
News Release from: Fairchild Semiconductor | Subject: GTLP18T612G and GTLP36T612G
Edited by the Electronicstalk Editorial
Team on 01 October 2001
GTLP backplane transceivers in BGA
packages
Fairchild Semiconductor has released a line of Gunning transceiver logic plus (GTLP) transceivers in BGA packaging, beginning with 18 and 36bit wide universal bus transceivers.
Fairchild Semiconductor has released a line of Gunning transceiver logic plus (GTLP) transceivers in BGA packaging, beginning with 18 and 36bit wide universal bus transceivers Expanding the industry's broadest portfolio of GTLP products, these devices provide greater than 60% space savings over existing TSSOP solutions
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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Fairchild's GTLP in BGA, combine smaller packaging with higher bit width to eliminate board space issues in today's highest performance backplane based systems.
BGA GTLP devices are offered in high-performance 0.8mm ball pitch BGA packaging.
Fairchild BGA package solutions provide multiple benefits including; reduced board space; better heat dissipation; reduced board cost1; and higher assembly yield compared to QVSOP, TVSOP and TSSOP2.
Together with Fairchild's GTLP backplane technology, these BGA packages provide a high performance backplane solution.
The GTLP universal bus transceivers can be run in a latched or registered mode.
Each operates at 3.3V and provides bi-directional LVTTL-to-GTLP signal-level translation, a 1.0V output swing, 100mV threshold voltage (Vth), and 50mA drive (IOL/IOH) for backplane driving.
Additional features include bushold, edge-rate control and high-impedance power up/down and off.
Bushold eliminates the need for external resistors by offering a known state on devices inputs.
GTLP's optimised edge-rate control reduces bus settling time and EMI.
High impedance power up/down/off supports live insertion into active backplane environments.
GTLP is a derivative of Gunning transceiver logic (GTL), a JESD8-2 JEDEC standard.
These devices are designed using Fairchild's Advanced BiCMOS process and are process, voltage and temperature compensated.
Fairchild plans to release up to ten GTLP transceivers in BGA packaging by Q4 2002.
The GTLP18T612G and GTLP36T612G are packaged in a 54- and a 114-ball BGA, respectively.
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