Product category:
Communications ICs (Wired)
News Release from: Fairchild Semiconductor | Subject: FIN7216-01
Edited by the Electronicstalk Editorial
Team on 04 February 2003
Less power needed for quad transceiver
Fairchild Semiconductor has a new quad-channel transceiver that uses 25% less power than comparable devices across an operating range from 100Mbit/s to 1.36Gbit/s.
Fairchild Semiconductor has a new quad-channel transceiver that uses 25% less power than comparable devices (2.2 compared with 2.75W) across an operating range from 100Mbit/s to 1.36Gbit/s Designed to be used as a general-purpose physical layer device (PHY) for proprietary backplanes or as a Fibre Channel or Gigabit Ethernet transceiver, the FIN7216-01 is pin compatible with competing solutions and has a lock time 25x smaller than them
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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The FIN7216-01 is also the first device of its kind to feature BIST through JTAG, greatly simplifying in-system functional testing.
Although rated at 2.2W, the FIN7216-01 can operate at even lower power when unused functions are disabled - a capability only offered on the Fairchild device.
This low power design minimises heat emission, simplifying board layout and lowers BOM and assembly cost by eliminating the need for a heat sink in most applications.
Designs using the FIN7216-01 can be further optimised for thermal management and power efficiency through use of Fairchild's broad array of DC/DC conversion products, temperature sensors and cooling fan motor controllers.
Design flexibility, ensured by the broad operating range of the FIN7216-01, is further enhanced by the capability to operate each of the four channels on the device independently or in tandem as a single 32bit parallel interface.
Reliability is maximised by the provision of redundant serial I/O and an ESD protection level of up to 2kV on the human body model.
Commenting on the launch Mike Fowler, Fairchild's principal product strategist for Interface Products said, "The FIN7216-01 provides engineers with superior technology for cost-effective new designs of switch fabric interconnect solutions and offers delivers an enhanced performance alternative supply for existing designs".
The FIN7216-01 is packaged in 27 x 27mm 256-pin thermally enhanced ball grid array (TBGA).
Engineering samples are available now.
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