Product category:
Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: FDZ299P
Edited by the Electronicstalk Editorial
Team on 27 May 2003
Tiny footprint shows merit of MOSFET
The FDZ299P is a low-voltage P-channel MOSFET in BGA packaging that provides top performance and up to 75% size reduction in battery management applications.
According to Fairchild, the FDZ299P delivers the industry's best electrical and thermal performance for its size This new P-channel mosfet's high-performance PowerTrench technology is housed in an ultrasmall, 1.5 x 1.5mm BGA package - offering a 75% size reduction compared with standard SSOT-6 or TSSOP-6 mosfets currently used in similar applications
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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This makes the FDZ299P an ideal solution for power management in applications such as cell phones, PDAs, portable music players, GPS receivers and digital cameras.
A mosfet's FFOM (footprint figure of merit) is the product of on resistance in milliohms and footprint size in square millimetres, and is a critical parameter for evaluating performance.
Fairchild's FDZ299P (at 80mohm x 2.25mm2) offers a 75% better FFOM of 180 when compared with a standard TSSOP-6 device with an FFOM of 720 (80mohm x 9.0mm2).
The FDZ299P also reduces parasitic system power drain by providing low-loss switching (maximum steady-state current of 4.6A).
The package height of the FDZ299P (maximum 0.8mm) allows this product to be used under RF shields, internal subassemblies and displays, fulfilling the growing industry demand for products with thinner, low-profile packages.
In addition to packaging advantages, this new device provides extremely low on resistance (55mohm at -4.5V gate-source and 80mohm at -2.5V) and low gate charge (maximum 9nC at 4.5V gate-source).
"Typical mosfets in standard packages of comparable size cannot dissipate above 150mW or handle a steady-state current above 350mA", said Chris Winkler, Fairchild's Market Development Manager for portable products applications.
"The FDZ299P, with its 1.7W of dissipation, leads the way when it comes to thermal performance and current handling capability".
The addition of this mosfet BGA further expands Fairchild's innovative package offering that includes FLMP, MicroPak and DQFN packaging.
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