Product category:
Discrete Power Devices
News Release from: Fairchild Semiconductor
Edited by the Electronicstalk Editorial
Team on 22 March 2004
Licence to proliferate BGA power
packaging
Fairchild Semiconductor has licensed Gem Services to offer one of Fairchild's most advanced MOSFET packaging technologies as open tooling for the power semiconductor market.
Fairchild Semiconductor has licensed Gem Services to offer one of Fairchild's most advanced mosfet packaging technologies as open tooling for the power semiconductor market This agreement will make Fairchild's ball grid array (BGA) power technology available for use by other semiconductor suppliers
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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Opening the tooling enables customers to multi-source their purchases of this previously proprietary BGA technology, thereby increasing product availability and lowering the customer's supply chain risk.
"Fairchild is the only manufacturer in full volume production of single and dual N- and P-channel BGA mosfets", commented Richard J Kulle, President and CEO of Gem Services.
"These devices can decrease component count while doubling, and sometimes even quadrupling, electrical and thermal performance of power devices.
In my experience these advantages are unparalleled and GEM is eager to support this important technology".
Fairchild developed and introduced its first BGA technology for mosfets in 1999.
In 2002, the company announced a complete, next generation line of BGA-packaged mosfets, which maintain conventional footprint characteristics while dramatically improving thermal and electrical performance.
Compared to standard leaded packages currently used in similar applications, Fairchild's BGA technology offers significant performance advantages, such as: low gate, drain, and source inductances; low gate, drain, and source resistances; low profile (0.9mm and less); low thermal resistance; the ability to be heat sunk from both the top and bottom of the package; high current density; and an excellent FFOM (footprint figure of merit - calculated as the product of on-resistance and package area consumed).
"Fairchild's BGA technology is the next generation in power management solutions", said Dr Izak Bencuya, Fairchild's Chief Strategy Officer, Executive Vice President and General Manager, Power Discrete Group.
"This agreement will allow Gem to offer the high-volume, widely adopted BGA packaging technology to other silicon suppliers, which will expand the number of products available while offering a multi-source supply of mosfet technology to the broadest range of customers".
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