Product category:
Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: FGA25N120ANTD
Edited by the Electronicstalk Editorial
Team on 04 October 2005
IGBT optimised for induction heating
A new IGBT combines best-in-class avalanche immunity with optimised tradeoff performance between switching and conduction losses to increase system reliability and efficiency for induction heating.
Fairchild Semiconductor's FGA25N120ANTD 1200V NPT-trench IGBT combines best-in-class avalanche immunity with optimised tradeoff performance between switching and conduction losses to increase system reliability and efficiency in induction heating (IH) applications Designed for microwave ovens, IH rice cookers and other IH cookers, the FGA25N120ANTD extends system lifetime by lowering operating temperatures as much as 10C over previous-generation devices
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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The NPT-trench IGBT uses Fairchild's proprietary trench technology and non-punch-through (NPT) technology.
This optimised cell design and thin wafer fabrication process allows the FGA25N120ANTD to withstand a maximum 450mJ of avalanche energy, thus ensuring fail-safe operation in abnormal avalanche-mode conditions.
"Unstable power, AC line surges and system malfunctions cause avalanche-mode conditions in induction heating applications that can lead to instantaneous device failure", said Taehoon Kim, Vice President of Fairchild's Functional Power Group.
"To answer these reliability issues in IH appliances, our new 1200V NPT-trench IGBT offers best-in-class avalanche immunity".
"It also optimises tradeoff performance to lower operating temperature and improve overall system efficiency".
The FGA25N120ANTD is available in a TO-3P lead (Pb)-free package and meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020B and is compliant with European Union requirements now in effect.
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