Product category:
Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: SuperFET in DPAK
Edited by the Electronicstalk Editorial
Team on 31 August 2006
MOSFETs are made for slimline ballasts
Low on-resistance 600V SuperFET MOSFETs address the DPAK (TO-252) device requirements of the latest ultraslim low-profile ballast applications.
Fairchild Semiconductor has developed a family of low on-resistance 600V SuperFET MOSFETs specifically to address the DPAK (TO-252) device requirements of the latest ultraslim low-profile ballast applications To minimise switching and conduction losses and meet system efficiency needs of these fast-switching lighting designs, Fairchild's DPAK SuperFETs offer as little as one-third the on-resistance (0.6 to 1.2ohms) of traditional planar MOSFETs
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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They also have the ability to withstand both high-speed voltage (dv/dt) and current (di/dt) switching transients necessary for ballasts to operate reliably at very high frequencies.
Typically, as the breakdown voltage of a standard MOSFET rises, its on-resistance also goes up exponentially and leads to increased die size.
Fairchild's proprietary SuperFET technology changes this on-resistance/die-size relationship from an exponential to a linear one.
This approach allows SuperFET devices to achieve a very impressive on-resistance and small die size, even at a 600V breakdown voltage.
Fairchild's SuperFET in DPAK is the latest evolution of this packaging innovation.
"We've added DPAK devices to our SuperFET product portfolio specifically to meet the energy efficiency and the space-reduction demands of lighting manufacturers", said Taehoon Kim, Vice President of Fairchild Semiconductor's Functional Power Group.
"Our proprietary SuperFET technology results in the extremely low on-resistance needed to decrease MOSFET die-size and make 600V/0.6ohm DPAK-packaged product possible".
"In comparison, typical 600V/0.6ohm planar MOSFET devices for lighting applications come in larger TO-220 or D2PAK (TO-263) packages".
"Fairchild's DPAK SuperFET technology offers our customers low on-resistance devices in more compact packaging, therefore addressing the growing market trend calling for slimmer electronic ballasts".
In addition to DPAK-packaged devices for ballasts, Fairchild offers a full portfolio of SuperFET products for lighting, active power factor correction (PFC) and AC/DC power-supply systems.
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