Product category:
Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: MicroFET family
Edited by the Electronicstalk Editorial
Team on 11 September 2006
MOSFETs promise thermal and space
advantages
Thermally enhanced ultracompact low-profile MOSFETs target low-power applications in the sub-30 and sub-20V range.
With the introduction of 11 new MicroFET MOSFET products, Fairchild Semiconductor now offers the industry's broadest portfolio of thermally enhanced ultracompact, low-profile (2 x 2 x 0.8mm) devices targeting low-power applications in the sub-30 and sub-20V range These include cellphones, digital cameras, games, remote POS terminals, and many other high-volume portable products where space optimisation and excellent thermal and electrical performance is essential for saving battery life and ensuring reliability
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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The MicroFET in a 2 x 2mm MLP is 55% smaller than a 3 x 3mm SSOT-6 MOSFET, while providing higher performance.
For example, compared with a typical dual P-channel SSOT-6 (9mm2) device, the MicroFET (4mm2) offers 17% lower on-resistance (95 compared with 115mohm) and 16% lower thermal resistance (151 compared with 180C/W (minimum copper pad values)).
In addition, MicroFET devices offer exceptionally better thermal performance and higher efficiency than larger 3 x 1.9mm MLP devices, and even in SC-70 packages with a similar small footprint.
compared with a dual P-channel SC-70 device, for instance, Fairchild's MicroFET offers 80% lower on-resistance and 65% lower thermal resistance.
"Fairchild offers the most complete portfolio of products available for serving low-voltage applications".
"These easy-to-implement, high-performance and space-saving MOSFETs are ideal for all of our customers' low-voltage switching and power management/battery charging systems", said Chris Winkler, Marketing Director, Low Voltage Power Segment.
"In 2005, Fairchild was first to introduce an MLP-packaged MicroFET with the high performance of a traditionally used SSOT-6 device with the footprint of an SC-70".
"With this introduction of 11 new devices, we're offering our customers a significantly expanded and augmented MicroFET family of products".
These lead (PB)-free devices meet or exceed the requirements of the joint ICP/JEDEC standard J-STD-020C and are compliant with the European Union regulations now in effect.
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