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Product category: Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: FDZ191P
Edited by the Electronicstalk Editorial Team on 30 November 2006

MOSFET is made for portable applications

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Small-footprint P-channel MOSFET offers optimal thermal and electrical performance for power conversion, charging and load management in high-volume portable electronics.

Fairchild Semiconductor has released the FDZ191P, the industry's smallest footprint P-channel MOSFET offering the optimal thermal and electrical performance necessary for power conversion, charging and load management in an array of low-voltage (below 20V), high-volume portable electronics Applications that particularly benefit from the features of this device include cellphones, digital cameras, MP3 players, medical devices and other portable products that increasingly pack "smart" functionality into smaller spaces

Fairchild's FDZ191P offers performance superior to the majority of power MOSFETs on the market designed for low-voltage applications.

As a PowerTrench MOSFET, the FDZ191P uses Fairchild's latest wafer-level chip scale package (WL-CSP), enabling excellent thermal resistance (83C/W) and low on-resistance (67mohm at 4.5V).

Available in an ultrasmall (1.0 x 1.5 x 0.65mm) package, the FDZ191P reduces board space by at least 30% compared with similar components, and its 0.65mm maximum package height makes it well suited to high-density products and ultra-thin consumer product designs.

It is also capable of operating down to 1.5V, an important feature in power-management designs.

Additionally, the FDZ191P meets all "green" and RoHS standards required by electronic applications worldwide.

"Fairchild's FDZ191P is setting the bar for the ultra-small, high-performance MOSFET market and exemplifies Fairchild's expertise in developing leading-edge packaging technology combined with high-density MOSFET silicon", said Chris Winkler, Marketing Director, Low-Voltage Power Segment.

"Fairchild's growing family of products in 1.0 x 1.5mm WL-CSP packaging offers designers ideal solutions for meeting the space and power-management circuit challenges presented by low-voltage designs".

This lead (Pb)-free device meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect.

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