Multichip module eases DrMOS power compliance

Highly integrated FET-plus-driver multichip module for high-current synchronous buck applications supports Intel's DrMOS Vcore DC/DC convertor standard.

Available now from Fairchild Semiconductor, the FDMF8700 is the first model in a new suite of highly integrated FET-plus-driver multichip modules for high-current synchronous buck applications supporting Intel's DrMOS Vcore DC/DC convertor standard.

The FDMF8700 is a fully integrated power-stage solution offered in a space-saving 8 x 8mm micro-lead frame (MLP) package.

By replacing a 12V driver IC and three N-channel MOSFETs, the FDMF8700 saves 50% board space compared with discrete component solutions.

The layout and size of the switches and driver die are optimised to enable higher-frequency operation and are intended for use in desktop and server VR11.x vCore conversion, high-current DC/DC point-of-load convertors and small form factor voltage regulator modules.

The FDMF8700 enables designers to maximise footprint power density, reduce component part count/BOM cost and shorten time to market.

"The FDMF8700 FET plus driver is specifically designed to achieve an optimum application solution by using components that are matched electrically, thermally and mechanically to the input and output characteristics of each element, leading to superior module performance unattainable any other way", said Guy Moxey, Director of Fairchild's Low Voltage Market Segment.

"The FDMF8700 exemplifies Fairchild's commitment to the computing industry through the development of fully optimised, integrated subsystems delivering higher efficiency, smaller footprint and more functionality, while providing superior performance".

Unlike discrete solutions where parasitic elements combined with board layout significantly reduce system efficiency, the FDMF8700 module is designed to both thermally and electrically minimise parasitic effects and improve overall system efficiency.

In operation, the high-side MOSFET is optimised for fast switching while the low-side device is optimised for low on-resistance.

This arrangement ideally accommodates the low-duty-cycle switching requirements needed to convert the 12V bus to supply the processor core with 1.0 to 1.2V at up to 30A.

Fairchild's MLP 8x8 power package extends the concept of enhanced packaging for DC/DC convertor applications.

The integrated FDMF8700 module provides an additional efficiency gain of 1.5 to 2% for peak- and steady-power levels compared with discrete solutions using D-Pak packaging.

The FDMF8700 is the first product in the new FET-plus-driver multichip module family.

Additionally, Fairchild offers a broad range of DC/DC solutions, including high- and low-side application-specific MOSFETs, multi-hase DC/DC controllers, and buck regulators.

Also available are multiple point-of-load devices, including LDOs and integrated switches offering up to 95% efficiency.

The FDMF8700 is available in a 56-pin (8 x 8mm) MLP.

This lead (Pb)-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect.

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