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Product category: Power Supply ICs and Controllers
News Release from: Fairchild Semiconductor | Subject: FDMF6700
Edited by the Electronicstalk Editorial Team on 13 July 2007

FET and driver combine for compact power

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Optimised and integrated FET plus driver power stage solution replaces discrete alternative to save more than 80% of PCB real estate.

Fairchild Semiconductor has produced a fully optimised and integrated FET plus driver power stage solution in an ultracompact 6 x 6mm MLP package The FDMF6700 offers designers a compelling solution for severely space-constrained applications such as small-form-factor desktops, media centre PCs, ultradense servers, blade servers, advanced gaming systems, graphic cards, networking and telecom equipment, and other DC/DC applications with limited board space

A typical buck convertor in a PC motherboard may include, per phase: three N-channel MOSFETs in a DPAK package and one driver IC in SO8 package.

By replacing these components with the new highly integrated FDMF6700, designers save more than 80% of valuable board space.

In addition, through the integration of components into an optimised single-package solution, parasitic inductances of board traces and leads of the individual discrete packages are eliminated, improving overall efficiency.

"Our FDMF6700 in the 6 x 6mm MLP package is 44% smaller than any other DrMOS device available in the market today", says Roberto Guerrero, World Wide Segment Manager for Desktop, Server and Gaming Products in Fairchild's Functional Power Group.

"This new solution places Fairchild as the leader in ultra-high-density DrMOS technology".

The FDMF6700 is available in a 40-pin (6 x 6mm) MLP.

These products use lead-free (Pb-free) terminals and have been characterised for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020.

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