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News Release from: FCI
Edited by the Electronicstalk Editorial
Team on 30 March 2004
BGA socket suit settled
FCI and Hon Hai Precision Industry have reached a settlement in their lawsuit involving FCI's ball grid array (BGA) connector technology as it relates to socket applications.
FCI and Hon Hai Precision Industry have reached a settlement in their lawsuit involving FCI's ball grid array (BGA) connector technology as it relates to socket applications In the frame of this settlement, FCI has granted a worldwide license to Hon Hai Precision Industry for the use of its BGA patented technology for the aforementioned applications
Both FCI and Hon Hai believe the settlement has paved the way for future co-operation between the two companies.
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