Product category:
Wireless Communications
News Release from: Flint | Subject: Mitsumi WML-C06
Edited by the Electronicstalk Editorial
Team on 01 August 2001
Ready to run Bluetooth in surface-mount
outline
A new type-approved Bluetooth module from Flint is offered as a single surface-mount component, ready for automated placement.
A new type-approved Bluetooth module from Flint is offered as a single surface-mount component, ready for automated placement Compliant with Bluetooth version 1.1 specifications, the Mitsumi WML-C06 module from Flint is a complete RF and baseband solution, freeing product developers from many of the complexities of implementing Bluetooth
This article was originally published on Electronicstalk on 24 Aug 2005 at 8.00am (UK)
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Component layout, laying the RF implications of the PCB, and much of the fine-detail of Bluetooth implementation such as the impedance matching of each discrete component have all already been addressed.
Being preapproved, the module also offers a fast route through the Bluetooth qualification process.
Measuring just 28 x 15 x 2.0mm, the WML-C06 supports Bluetooth class 2 operation.
UART, USB, SPI and 13bit PCM interfaces are built in, and a PIO port and Flash memory driver are also included.
Using high-density placement techniques, Mitsumi has implemented the necessary synthesisers, receiver, transmitter, baseband controller and memory management, microprocessor, RAM, Flash and external interfaces in an ultra small and thin 28-pin SMD package.
Applications for WML-C05 include industrial control, remote data loggers, metering, security and automotive information management systems and industrial applications looking for an easy to implement, low cost and high performance communications technology.
The module complies with CE, FCC and other international EMC regulations.
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