Adaptable IEEE1386 connectors

Edited by the Electronicstalk editorial team Feb 27, 2002

New from Flint is a range of adaptable board-to-board connectors for IEEE 1386 Common Mezzanine Card (CMC) applications, that accommodate a wide range of interboard spacings.

New from Flint is a range of adaptable board-to-board connectors for IEEE1386 Common Mezzanine Card (CMC) applications, that accommodate a wide range of interboard spacings.

A key feature of the Molex 71439 and 71436 series is its flexibility, since it is offered in mating heights from 8.0 to 15.0mm in 1.0mm increments, to simplify system design.

These CMC connectors follow the 64-circuit, 1.0mm pitch IEEE1386 format, featuring a leaf-style design for pin protection, anti-flux design and low insertion and removal force.

Applications include adding PCI mezzanine cards to VME and Futurebus+ hosts.

The connectors are supplied in tape/reel packaging with pick and place vacuum caps for auto placement.

The product comes without through-hole PCB pegs as standard (optional pegs are available).

The high temperature LCP housing withstands reflow solder processing and is certified to UL94V0.

Gold plated pins ensure contact resistance below 30mohm in applications up to 1.0A and 250V withstand voltage.

Minimum insulation resistance is 1Gohm.

The 71439 and 71436 connectors follow the IEEE1386 two-row layout and can be used in 64, 128, 192 or 256 circuit combinations in +5, +3.3 and 12V applications.

All connectors are constructed in UL94V0 nylon compatible with SMT reflow, and feature metal solder tabs to provide PCB hold down and strain relief for SMT tails.

Insulation resistance for each is 50Mohm minimum, and withstand voltage is 250V AC for 60s.