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    <title>RSS News Feed for Mentor Graphics Mechanical Analysis Division - from Electronicstalk</title>
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    <description>Mentor Graphics Mechanical Analysis Division news releases on Electronicstalk</description>
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    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Sat, 22 Nov 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Sat, 22 Nov 2008 08:00:00 UT</lastBuildDate>
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      <title>Flovent software determines TDV guidelines</title>
      <description>Aecom consultants used Flovent software from the Mentor Graphics Mechanical Analysis Division to determine the viability of and guidelines for the use of thermal displacement ventilation (TDV).</description>
      <pubDate>Wed, 19 Nov 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo218.html</link>
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      <title>Thermal simulation helps platform beat ATCA specs</title>
      <description>Design team leader claims that thermal simulation is like having X-ray vision.</description>
      <pubDate>Wed, 06 Aug 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo217.html</link>
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      <title>Thermal simulation cuts potting costs in half</title>
      <description>The Flopack web-based wizard quickly produces accurate models of integrated circuits and other components.</description>
      <pubDate>Thu, 10 Jul 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo216.html</link>
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      <title>Software helps deal with growing heat problem</title>
      <description>The Redback SE1200 platform contains a total of 12 line cards, whose power dissipation is substantially higher than the previous-generation product.</description>
      <pubDate>Thu, 26 Jun 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo215.html</link>
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      <title>CFD software solves LED heat problem</title>
      <description>Voxdale engineers used the CFD results to redesign the housing in just one day to improve airflow, which eliminated overheating and increased light output and life to the desired levels.</description>
      <pubDate>Wed, 18 Jun 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo214.html</link>
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      <title>Thermal software gets thumbs up</title>
      <description>Flotherm provides tools that allow users to assemble models from libraries, avoiding the need to create them from scratch.</description>
      <pubDate>Thu, 12 Jun 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo213.html</link>
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      <title>Software workshops ease heat problems</title>
      <description>Flomerics' workshops will explain how to simulate the thermal performance of an existing or planned data centre configuration using templates and libraries.</description>
      <pubDate>Wed, 21 May 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo212.html</link>
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    <item>
      <title>Thermal software speeds custom heatsink design</title>
      <description>Crane Mechanical Engineer Mark Resler simulated a range of different heatsink configurations using thermal simulation software.</description>
      <pubDate>Fri, 16 May 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo211.html</link>
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      <title>Thermal simulation removes basestation hotspot</title>
      <description>Improved cooling scheme first modelled using thermal simulation software enables more powerful amplifiers to be placed in compact enclosures.</description>
      <pubDate>Wed, 23 Apr 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo210.html</link>
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    <item>
      <title>Thermal software simplifies design work</title>
      <description>ThermPaq thermal characterisation and design is entirely wizard-driven, which makes it attractive for engineers who are not thermal specialists.</description>
      <pubDate>Fri, 11 Apr 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo209.html</link>
    </item>
    <item>
      <title>Fluid dynamics to keep missiles cool</title>
      <description>Software used to analyse complex defence electronics cooling problems at the front end of the design process.</description>
      <pubDate>Wed, 19 Mar 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo208.html</link>
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      <title>Simulation is cool answer for supercomputer lab</title>
      <description>CFD simulations save money by determining exactly how much cooling capacity is required to handle current and projected thermal loads.</description>
      <pubDate>Wed, 12 Mar 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo207.html</link>
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      <title>Software helps design cool lighting</title>
      <description>Dialight is using Pro/Engineer Wildfire to design LED lighting that minimises the heat produced.</description>
      <pubDate>Wed, 05 Mar 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo206.html</link>
    </item>
    <item>
      <title>Project calls for intelligent micro-scale tester</title>
      <description>Tester will be based on T3Ster, MicReD's world-leading transient test equipment for semiconductor chip package thermal characterisation.</description>
      <pubDate>Thu, 28 Feb 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo205.html</link>
    </item>
    <item>
      <title>Software slashes burn-in development time</title>
      <description>Thermal simulation enabled Moody to accurately predict the thermal resistance of each design iteration without having to build and test the prototype.</description>
      <pubDate>Wed, 16 Jan 2008 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo204.html</link>
    </item>
    <item>
      <title>Simulation validates high-power chassis design</title>
      <description>Project demonstrates how thermal simulation can be used in the early stages of the design process to minimise expensive late-stage changes and reduce time to market.</description>
      <pubDate>Thu, 20 Dec 2007 08:00:00 UT</pubDate>
      <category>Mentor Graphics Mechanical Analysis Division</category>
      <link>http://www.electronicstalk.com/news/flo/flo203.html</link>
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