More options in IC package design
Flopack V3.1 is the latest version of the web-based SmartPart library from Flomerics for the fast, accurate and reliable creation of IC packages and associated parts.
Flopack V3.1 is the latest version of the web-based SmartPart library from Flomerics for the fast, accurate and reliable creation of IC packages and associated parts.
Parts created within Flopack can then be instantly imported into Flomerics' Flotherm software developed to analyse the cooling requirements of electronic components and systems.
New features contained within Flopack V3.1 include a corporate multi-user function that allows internal workgroups to share the same designs so avoiding duplication; an extended range of Delphi compact models for cavity-down PBGA, TBGA and ChipArray families; and a new Jedec test environment wizard, that guides engineers through the creation of standard test environments determined by Jedec and allows them to import designs directly into Flotherm.
Other features include a flip-chip PBGA SmartPart upgrade, that enables users to define more of the complex details that make up the substrate of the flip-chip PBGA package and a significant upgrade to the wire-bonded PBGA SmartPart library including separate input fields for the solder mask below the die and an option to selectively disconnect thermal vias from one or more metal layers in the substrate.
Commenting on Flopack V3.1, Sarang Shidore, Director of Web Business, Flomerics, said: "Providing Design Engineers with productivity gains is the driving force behind all of Flomerics' products.
Flopack V3.1 achieves this by improving the speed and consistency of IC package thermal analysis and by making it even easier for those people who are not usually involved with IC package design to realise substantial improvements in productivity".
Annual licences for Flopack start at $3500 US.
Annual licences for Flotherm start at $19,500.
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