Product category:
Design and Development Software
News Release from: Flomerics
Edited by the Electronicstalk Editorial
Team on 18 December 2002
Alliance to boost thermal modelling
Flomerics and Harvard Thermal are to work together to develop and enhance software tools and standards for thermal modelling of electronic components.
Flomerics and Harvard Thermal are to work together to develop and enhance software tools and standards for thermal modelling of electronic components Both companies share the goal to provide the electronics industry with accurate, validated thermal models of electronic components that can be produced quickly and easily, stored in a central web-based database, and used in thermal analysis software tools such as Flotherm and TASPCB
This article was originally published on Electronicstalk on 6 Aug 2008 at 8.00am (UK)
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The Flopack web-based wizard quickly produces accurate models of integrated circuits and other components.
The web-based Flopack software, launched by Flomerics in 1998, has become the recognised standard for rapid generation of thermal models for IC packages.
Flomerics and Harvard Thermal will now combine their expertise and resources to accelerate development of the Flopack software.
In parallel, Flomerics and Harvard Thermal are working with the JEDEC JC15.1 committee in the USA to develop software-independent standards for producing thermal models of IC packages.
Planned future enhancements to the Flopack software include: definition of a standard export format, conforming with the new JEDEC standards outlined above, to allow export of thermal models not only to Flotherm, but also to Harvard Thermal's TASPCB, and other software tools such as ANSYS, NASTRAN and FEMAP; a web-based library manager, creating a central area on the Internet where component manufacturers can upload and maintain thermal models of their parts, and where end-users can browse and download the thermal models they require; enhancing the "corporate workgroups" features to facilitate model-sharing within organisations; continuing expansion of IC package types to include system-in-chip and optoelectronics components; extension from steady-state to transient models; direct import of CAD geometry for complex package elements such as leadframes and substrates; and thermal solver enhancements, including a preconditioned conjugate-gradient solver that can handle temperature-dependent orthotropic properties. Request free introductory details about products from Flomerics ...
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