Thermal analysis spots "paradoxical" heatsink
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Mentor Graphics Mechanical Analysis Division product story
Edited by the Electronicstalk editorial team
Apr 9, 2003
Thermal analysis has played a crucial role in significantly reducing development costs and time to market for IFR's new ultracompact IFR 3410 range of RF signal generators.
Flomerics Thermal Design Services (TDS) has played a crucial role in significantly reducing development costs and time to market for IFR's new ultracompact IFR 3410 range of RF signal generators for the wireless test market, which combine wide frequency cover and high performance digital modulations in a small package.
IFR's new product range was developed in response to the worldwide growth of second and third generation wireless communications systems and the prevailing demand for products with digital modulation capabilities.
Working with IFR's mechanical engineering team, TDS used Flomerics' Flotherm thermal management software to simulate the cooling requirements of their new product range.
Analysis revealed that a fan mounted on an enclosure within the product's RF compartment was causing heated air (the primary cause of electronic failure) to recirculate, and the effect of a finned heatsink was identified as being paradoxical.
Through further analysis the team identified a solution that enabled both the fan and the heatsink to be omitted from the design, thus reducing the product's cost and acoustic emissions.
The analysis also revealed that the air velocities through the product's power supply compartment were non-uniformly distributed and below target, whilst the airflow path swirled through the compartment, resulting in temperatures exceeding their limits.
Again through further analysis the team identified a solution that addressed these shortcomings, ensuring temperature limits were met.
Commenting on the project, Clint Davis, Senior Mechanical Engineer, IFR said, "By working simultaneously closely with Flomerics' Thermal Design Services team, IFR was able to significantly cut the development time required to bring to market this extremely compact, high performance product.
The work enabled us to increase the product's reliability, whilst simultaneously reducing its acoustic emission levels and overall cost".
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