Product category:
Design and Development Software
News Release from: Flomerics
Edited by the Electronicstalk Editorial
Team on 26 May 2006
Collaborative effort wins best paper
award
A paper co-authored by Flomerics and the Budapest University of Technology and Economics is the IEEE Transactions on Components and Packaging Technologies paper of the year.
A paper written by two Flomerics executives, Marta Rencz and Andras Poppe, as well as Erno Kollar, Sandor Ress and Vladimir Szekely of the Budapest University of Technology and Economics (BUTE), has been selected as the best of 2005 by the editors of the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Components and Packaging Technologies The paper, entitled "Increasing the accuracy of structure function based thermal material parameter measurements", was selected from among nearly 100 manuscripts published in the past year's volume of the Transactions
This article was originally published on Electronicstalk on 13 Aug 2001 at 8.00am (UK)
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The paper appeared in the March 2005 issue (volume 28, issue 1, page 51-57).
The award will be presented on 1st June 2006 at the 56th Electronic Components and Technology Conference in San Diego, California.
The paper explains that structure functions provide a one dimensional representation of the heat flow path of thermal systems and can be obtained by fast and simple thermal transient measurements.
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The usual way of generating structure functions considers only one heat path.
Heat is switched on a point in the structure and the temperature of the point is recorded as a function of time until a steady state is reached.
The structure functions are determined by direct mathematical transformations from the measured transient curves.
There is always a certain error in these measurements due to parasitic heat flow moving in other directions than the one dimension that is being measured.
Parasitic effects can consist of natural convection, radiation losses, and conduction through the fixture itself.
The new method developed by the Flomerics and BUTE researchers improves measurement results by accounting for parasitic heat flow.
This method measures the parasitic heat flow path in addition to the thermal transients and then subtracts the thermal impedance of the parasitic branches during the phase of generating the structure functions.
The paper presented an application example involving measuring the effective thermal conductivity of a patterned printed circuit board.
The paper also included the results of a set of verification experiments in a vacuum chamber that considered the effects of parasitic heat flow paths with single parallel thermal resistances.
The authors are currently working on considering parallel heat flow paths with their structure functions.
Rencz and Poppe joined Flomerics when Flomerics purchased Micred - a Hungarian based company formed in 1997 as a spin-off from BUTE.
Rencz is now Chief Executive Officer and Poppe is the Chief Marketing Officer of the Micred subsidiary of Flomerics.
Micred's main product is the "T3Ster" (pronounced "Trister"), which provides fast, repeatable and accurate thermal characterisation of IC devices, including stacked-die and system-in-package devices.
The T3Ster provides nondestructive dynamic thermal characterisation of packages semiconductor devices such as diodes, BJTs, J-FETs, MOSFETs, thyristors, power LEDs, MCMs and other electronic and MEMS components. Request free introductory details about products from Flomerics ...
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