Thermal modelling for IC designs

Flomeric software models thermal behaviour inside integrated circuits

Flomerics has launched Flopack V6.2 - the latest version of its Web-based SmartPart library that generates fast, accurate thermal models for IC packages and associated parts.

Thermal models created within Flopack can be instantly imported into Flomerics' Flotherm or FloPCB software to analyse the cooling requirements of electronic components, boards and systems.

Key new features contained within Flopack V6.2 include: a major expansion of the power/discrete semiconductor package library; a new parametric rules engine that checks for errors in design data inputs; an enhanced, more accurate model for bond-wires; and overall improved usability.

Commenting on Flopack V6.2, Sarang Shidore, Flomerics' Product Manager for Semiconductor Software Products says, "Providing Design Engineers with productivity gains is the driving force behind all of Flomerics' products".

"Flopack V6.2 achieves this by continuing to expand its already formidable package portfolio, incorporating new design-friendly features, and by making it even easier for those people who are not usually involved with IC package design to realise substantial improvements in productivity".

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