Thermal software simplifies design work

ThermPaq thermal characterisation and design is entirely wizard-driven, which makes it attractive for engineers who are not thermal specialists.

Flomerics has released ThermPaq, software that eases the process of semiconductor thermal characterisation and design.

ThermPaq provides a fast, simple, automated process that reduces the number of distinct steps required of thermal experts, reducing the risk of modeling errors to enhance the quality, reliability and package thermal models.

ThermPaq is built upon Flomerics' Flopack SmartPart technology and Flotherm's CFD solver.

The web-based tool is entirely wizard-driven, which makes it attractive for engineers who are not thermal specialists.

The result is a fully automated process for generating accurate package models and computing the complete set of Jedec-compatible thermal characterisation data.

These include all Theta and Psi metrics under various environmental conditions and industry-standard compact thermal models.

Interfacing with Cadence APD, ThermPaq can take advantage of existing BGA layouts to capture metallisation and via placement detail.

ThermPaq also serves as a powerful design tool for thermal specialists.

Changes in thermal performance can be investigated through parametric variation of key package parameters to optimise the package thermal design.

A search function on all key package parameters and metric values allows the user to optimise the starting point for a new design.

Package sub-elements such as substrates and leadframes are stored as separate libraries, facilitating the use of data from third-party vendors.

Direct interfaces to semiconductor manufacturer packaging databases can also be created with minimal customisation.

The system provides a productivity boost for semiconductor package characterisation and design.

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