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Fluent
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Address:
10 Cavendish Court
Centerra Resource Park
Lebanon
NH 03766
USA
Telephone: (USA) +1 603 643-2600
http://www.fluent.com
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Listing of all 17 news releases from Fluent:
Software advances IC package design
Release provides IC package designers with a flexible modelling environment to set up and analyse a wide range of system-in-package designs.
News from Fluent ( 8 March 2007)
Cooling design software handles complex geometries
Version 4.3 of Icepak introduces key new technologies in the thermal design of electronic systems.
News from Fluent (29 November 2006)
Upgrade for EMI analysis
The latest version of Icewave incorporates enhanced model building capabilities and radiation computation for EMC/EMI analysis of electronic systems.
News from Fluent (24 October 2006)
Package analysis expands to next-generation ICs
Fluent has released a new version of its Icemax software, claimed to be the world's fastest circuit extraction tool for analysing advanced IC package designs.
News from Fluent (18 April 2006)
EM modelling works alongside thermal design
Icewave solves broadband electromagnetic emission and interference problems and generates both transient and frequency-domain results in a single run.
News from Fluent (21 October 2005)
Software optimises thermal design
The newest version of Icepak incorporates optimisation capabilities for thermal design of electronic systems.
News from Fluent (21 October 2005)
Circuit extraction tool upgraded
Icemax 2.1 is a major new update to the tool, targeted specifically toward providing a more integrated design flow for customers using Cadence's Allegro Package Design environment.
News from Fluent ( 2 September 2005)
Import tool smoothes the way to thermal analysis
Icepro 4.1 is the latest version of the model clean up and import tool for electronics cooling analysis.
News from Fluent (26 May 2005)
Software offers thermal validation for IC packages
Icechip is novel package-level thermal validation software for IC package designers.
News from Fluent (17 February 2005)
Thermal design software turns to IC packages
Fluent and Harvard Thermal have entered into a technology licensing agreement to embed Harvard Thermal's PTD product into Icechip, a detailed thermal design software for IC packages.
News from Fluent (23 December 2004)
Software tackles complex IC package layouts
The second major release of the Icemax IC electrical modelling software package includes a range of new capabilities and enhancements.
News from Fluent (22 November 2004)
Package puts PCB designs to the thermal test
Iceboard is a novel board-level thermal validation tool for printed circuit board designers.
News from Fluent (28 April 2004)
Software aids CAD to thermal model conversions
Icepro 4.0 is a model clean-up tool for electronics cooling analysis that makes it easy to convert any CAD model into an efficient thermal model.
News from Fluent (20 February 2004)
Signal integrity tool solves IC package parasitics
Developed to address signal integrity issues in today's high-speed IC package designs, Icemax provides substrate designers and electrical analysts with a simple highly automated modelling environment.
News from Fluent (31 December 2003)
Software optimises heatsink design
Qfin 3.0 is an easy-to-use tool for designing optimised heatsinks.
News from Fluent (25 June 2003)
Desktop simulation of cooling pays dividends
In an economy where negative growth is all-too-normal, Fluent reports dramatic and sustained growth in its computational fluid dynamics software products.
News from Fluent (20 May 2003)
Cooling simulation helps reduce design time
User application article Electronics cooling simulation is helping a major aerospace manufacturer reduce design time while minimising system weight, according to Dr Samir El-Khabiry of Illinois-based Hamilton Sundstrand.
News from Fluent ( 1 November 2002)
