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Product category: Standard Logic Devices
News Release from: Fujitsu Microelectronics Europe | Subject: MB15F7xUL Series PLLs
Edited by the Electronicstalk Editorial Team on 15 March 2001

Low-power dual PLL frequency
synthesisers

A new series of dual phase-locked loop (PLL) frequency synthesisers designed by Fujitsu feature extremely low power consumption, fast lock times and ultrasmall packaging.

A new series of dual phase-locked loop (PLL) frequency synthesisers designed by Fujitsu feature extremely low power consumption, fast lock times and ultrasmall packaging that are ideal for mobile phones and other communications products The new MB15F7xUL Series PLLs, members of the UL family, are now all available from Fujitsu Microelectronics for use in mobile phones, PDAs and all wireless communications applications

The devices support operating frequencies from 50MHz to 2.6GHz to meet all major phone standards.

Adopting Fujitsu's advanced U-ESBIC4 BiCMOS process and newly designed circuits, the UL Series is made up of the MB15F72UL, which has maximum operating RF and IF frequencies of 1300 and 350MHz, respectively, while consuming 2.5mA at 2.7V.

The MB15F73UL consumes 3.2mA at 2.7V and can operate at 2250/600MHz maximum RF/IF frequencies.

The third device, the MB15F78UL has operating RF/IF frequencies up to 2600/1200MHz and consumes only 4.5mA at 2.7V, or 20% less than the previous model (MB15F78SP).

Moreover, by designing new independent circuits, Fujitsu was able to reduce the lock-up time by approximately 20% over the previous range.

With the same pin layout as the previous PLL series (SP), the devices are fully interchangeable.

Other special features include guaranteed low-power voltage operation; Vcc = 2.4-3.6V; a stable charge pump circuit capable of dual current switching through serial data transfer; +/-1.5, +/- 6.0mA, and high sensitivity inputs: Vfin (min)= -15dBm (500ohm system).

The MB15F7xUL Series PLLs are fabricated using the latest Fujitsu advanced 0.35-micron BiCMOS technology.

The devices are available in two different packages.

The thin bump chip carrier package BCC20 has an area of 12.24mm2 and is 0.6mm in height, reducing the total area by 25%.

The other package used is the 20-pin L-leaded TSSOP. Request a free brochure from Fujitsu Microelectronics Europe ...

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