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News Release from: Fujitsu Microelectronics Europe | Subject: Eight-chip MCP
Edited by the Electronicstalk Editorial
Team on 15 May 2002
Multichip package crams eight into one
Fujitsu Microelectronics has developed an ultra-high-density multichip package (MCP) that can support up to eight chips.
Fujitsu Microelectronics has developed an ultra-high-density multichip package (MCP) that can support up to eight chips This development was made possible by the company's advances in thin chip processing and multistacked package technology
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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Thin chip processing is a special wafer-support technology that permits chips to be polished down to a thickness of only 0.025mm, and multistacked package is a technology which enables the stacking of boards mounted with chips using lead-free solder balls.
This package is functionally equivalent to a single package.
The new technology provides the smaller, thinner, more densely integrated and higher-capacity LSI packages, such as chip-scale packages (CSPs) and MCPs, demanded by today's mobile phones, digital audio/video equipment, IC cards and compact hard disk drives.
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Typically, the mounted surface area on a circuit board allows for 1.2-1.6mm thick packages.
The thickness allowed for one chip depends on the number of stacked chips per package.
Thus, three-stacked packages require 0.15mm thickness per chip, while four-stacked need 0.1mm, and five or more demand 0.08mm or less.
To create chips less than 0.1mm thick, however, requires a chemical process beyond conventional polishing techniques, entailing longer chip processing times, higher equipment costs and problems associated with environmental emissions.
The new MCP is the result of improvements in both ultra-thin wafer processing and advanced multiple chip packaging technology.
This slimming process enables the production of wafers as thin as 0.025mm without the use of chemicals, resulting in reduced manufacturing cycles, equipment costs and impact on the environment.
While Fujitsu's existing MCPs could house a maximum of four chips within a 1.6mm package height, the new wafer-slimming process alone makes it possible to produce MCPs with up to six-stacked chips.
Combined with the company's advanced new packaging technology, a maximum of eight chips (package height of 2.0mm) can now be mounted onto a single MCP.
Another benefit of these technological advances is that IC Cards and compact hard disk drives, which previously could hold only two-chip packages, are now able to support three-chip combinations.
The new packaging technology is an ideal mounting technique for ultra-high-density packages.
Until now, each circuit board was limited in the size of chip that could be mounted onto it, and complications arose in configuring outside electrical connections when layering chips of identical sizes, as electrical connectors could not be stacked to reach upper layers.
With this advanced packaging technique, chips are attached to one or both sides of the circuit board while using lead-free solder balls to bond packages to the board.
This makes it possible to stack a number of chips of all shapes and sizes. Request a free brochure from Fujitsu Microelectronics Europe ...
(This was Electronicstalk's Top Story on 14 May 2002).
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