Product category:
Memory Devices and Modules
News Release from: Fujitsu Microelectronics Europe | Subject: MB84VY6A4A1
Edited by the Electronicstalk Editorial
Team on 28 October 2002
Mobile memory device crams in six of the
best
Fujitsu has used its latest PS-MCP (package stacked multichip package) technology to produce a high-density and large-scale MCP combining six memory devices for mobile communications.
Fujitsu has used its latest PS-MCP (package stacked multichip package) technology to produce a high-density and large-scale MCP combining six memory devices for mobile communications The MB84VY6A4A1 is the first device of its kind, and mass-production will commence early November 2002
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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Recently, mobile phones have started to offer a wide variety of functions such as the capability for sending photos, using the Internet, listening to music and video distribution, in addition to calls.
These advances demand that for the mobile phones of the future memory packages need to be smaller, more densely integrated and of higher capacity.
The new MCP from Fujitsu has been designed to meet these market needs.
It features the same 15 x 11 x 1.4mm outline as the MB84VA128A four-stacked MCP, in a 179-ball BGA package, but with 20% more memory capacity.
In addition, the two packages that are combined to form one using the PS-MCP technology are electrically divided into two independent databuses, which enables data and programs to be processed simultaneously.
The chip structure of the MB84VY6A4A1 MCP featuring four chips in the upper package: 128Mbit NOR-type dual-operation Flash memory with page read mode; 64Mbit NOR-type dual operation Flash memory; 64Mbit mobile FCRAM; and 32Mbit mobile FCRAM.
The lower package features two chips, a 32Mbit NOR-type dual operation Flash memory and an 8Mbit low-power-consumption SRAM.
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