Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Fujitsu Microelectronics Europe
Edited by the Electronicstalk Editorial
Team on 16 January 2006
New fab to run 65nm process
Fujitsu is to construct a new fab to mass-produce logic semiconductors employing leading-edge 65nm process technology and 300mm wafers.
Fujitsu is to construct a new fab to mass-produce logic semiconductors employing leading-edge 65nm process technology and 300mm wafers The fab will be constructed at Fujitsu's Mie semiconductor plant, in Mie prefecture of central Japan, as the second 300mm fab of the plant and will be referred to as 300mm Fab No 2
This article was originally published on Electronicstalk on 16 Feb 2001 at 8.00am (UK)
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In addition to accommodating increasing demand for semiconductors produced using advanced processes through construction of the new fab, by continuing to offer optimised solutions and high-performance products based on leading-edge technologies, Fujitsu will continue to be a trusted business partner to its customers.
300mm Fab No 2, which will feature a dual-level clean room structure, is scheduled to be constructed within fiscal 2006 (April 2006-March 2007) and become operational from April 2007, with volume shipments expected to start from July 2007.
During the two year period till the end of fiscal 2007, Fujitsu will invest approximately Y120 billion in the new fab and production capacity will reach 10,000 wafers per month.
Further investments will be made in stages as the company evaluates trends in market demand.
Fujitsu expects the maximum capacity of the facility will be 25,000 wafers per month.
300mm Fab No 1, the first 300mm fab that was constructed at the Mie plant with a line for mass production of 300mm wafers employing 90nm technology, has been operational since April 2005 and will reach a production capacity of 15,000 wafers per month in fiscal 2006.
Fujitsu has been highly praised by its customers for its ability to offer advanced process technologies which realise high-speed operation and low power consumption simultaneously, a competitive edge made possible by its transistor technologies and copper wiring and low-K process technologies, in addition to receiving high marks for its design methodologies which enable first-shot full operation.
Fujitsu is continuously in negotiations with various global technology partners, and expects that from fiscal 2007, demand will significantly exceed the production capacity of its currently operating 300mm Fab No 1.
By constructing 300mm Fab No 2 with a dual-level clean room structure capable of easy expansion of capacity, Fujitsu will ensure a stable supply of leading-edge logic chips to its customers. Request free introductory details about products from Fujitsu Microelectronics Europe ...
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