Product category:
PCB Connectors
News Release from: Genalog | Subject: Wide spacing interfaces
Edited by the Electronicstalk Editorial
Team on 21 November 2001
Interfaces accomodate cooling spaces
Genalog can now supply matched impedance and high-speed micro-pitch interfaces for applications requiring elevated designs.
Genalog can now supply matched impedance and high-speed micro-pitch interfaces for applications requiring elevated designs This particularly applies where board-to-board spacing greater than 16mm is required to clear common heatsink profiles to provide good thermal dissipation
Typical applications include hubs, bridges, routers and data storage systems where increased ventilation and air circulation are required.
Interfaces are available with 19, 22, 25 and 30mm board spacing and full surface mount designs are available on 0.8 and 0.5mm pitch.
A mixed technology product is offered on a 0.635mm pitch with through-hole ground plane and surface mount signal pins and 18.75 and 22mm stack heights.
These high speed interconnects are fully tested for 50ohm systems for impedance, attenuation, crosstalk, propagation delay and rise time.
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