Product category:
PCB Connectors
News Release from: Genalog | Subject: Samtec 0.8 and 1mm connectors
Edited by the Electronicstalk Editorial
Team on 09 September 2002
Micro connectors pack in the contacts
A new range of 0.8 and 1mm pitch micro pin-and-socket connectors significantly increases interconnect density for small-form-factor microminiature applications.
A new range of 0.8 and 1mm pitch micro pin-and-socket connectors significantly increases interconnect density for small-form-factor microminiature applications without sacrificing the electrical and mechanical benefits of traditional pin and socket construction, says Genalog Developed by Samtec, the 0.3mm square terminals mate with either dual- or single-beam contacts, and both are suitable for pass-through applications
The 0.8mm system includes headers and stackers to provide board spacing from 5 to 9mm when mated, and the dual row interconnects have up to 90 pins per row for pinout densities as high as 350 per square inch of board space.
The 1mm pitch system also includes headers and stackers with board spacing from 3.5 to 9.25mm when mated, and both include right-angle headers for perpendicular board interface applications.
• Genalog: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
